Science and Engineering Equity Development (SEED)

Science and Engineering Equity Development (SEED) Scholars Program

Painted letters SEED

The Science and Engineering Equity Development (SEED) Scholars program supports the success of academically-talented students with demonstrated financial need in the fields of computer science, engineering and mathematics. Qualifying students will receive full undergraduate tuition for four years, in addition to three paid co-operative summer internships and mentoring from an impressive lineup of corporate partners, including Ford Motor Company, Walbridge, and Ghafari.

 

Details

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    Benefits

    • Full tuition support for four years
    • Three paid co-operative summer internships
    • Academic, professional and peer mentoring
    • Academic and social supports (including weekly sessions throughout academic year)
    • Community of peer scholars
    • Summer college acclimation experience
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    Requirements

    • U.S. citizen or permanent  resident
    • Admitted to Computer Science or Engineering at Detroit Mercy
    • Demonstrated financial need via FAFSA (Pell grant eligible)
    • Minimum 3.3 GPA
    • SAT and ACT test scores are optional to include in Detroit Mercy applications. If included, scores at or above 1060 SAT (Math 560) and/or 23 ACT may help strengthen SEED candidacy
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    How to Qualify

    • Complete a Detroit Mercy application at udmercy.edu/apply and indicate a Computer Science or Engineering major
    • Optional: email seed@udmercy.edu for more information or to express interest
    • Detroit Mercy faculty will screen for eligible candidates and reach out to schedule an interview
    • Interview with faculty in late January/early February
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    Refer a Student

    • Know a student who would be a good fit for the SEED program? Recommend them here by November 30, 2024 for priority consideration. Recommendations are not required for this scholarship, however they help us identify interested and highly qualified students.
    • Share the SEED Flyer: English Version / Spanish Version